Relationship between copper concentration and stress during electromigration in an Al(0.25 at.% Cu) conductor line

Journal of Applied Physics

Volumn 93, Issue 5, 2003, Pages 2516-2527

  Kao, H K ^a,c   Cargill III, G S ^a   Giuliani, F ^a,d   Hu, C K ^b  

^a Lehigh University   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c INTEL CORPORATION   (United States)

^d UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; DEFECTS; ELECTRIC CONDUCTORS; ELECTRIC LINES; FINITE ELEMENT METHOD; STRAIN;

CONDUCTOR LINES;

ELECTROMIGRATION;

EID: 0037348071     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1539282     Document Type: Article

References (35)

1. I. Ames, F. M. d'Heurle, and R. E. Horstmann, IBM J. Res. Dev. 14, 461 (1970).
2. C.-K. Hu, M. B. Small, and P. S, Ho, J. Appl. Phys. 74, 969 (1993).
3. M. B. Small, D. A. Smith, and A. J. Garratt-Reed, Scr. Metall. Mater. 30, 1531 (1994).
4. D. T. Carpenter, M. Watanabe, D. B. Williams, K. Barmak, and D. A. Smith, in Boundaries and Interfaces in Materials: The David A. Smith Symposium, edited by R. C. Pond, W. A. T. Clark, A. H. King, and D. B. Williams (TMS, Warrendale, PA, 1998), p. 199.
5. R. Rosenberg and L. Berenbaum, in Atomic Transport in Solids and Liquids, edited by A. Lodding and T. Lagerwall (Naturforschung, Tübingen, 1971), p. 113.
6. R. Rosenberg, J. Vac. Sci. Technol. 9, 263 (1972).
7. H.-K. Kao, G, S, Cargill III, and C.-K. Hu, J. Appl. Phys. 89, 2588 (2001).
8. H.-K. Kao, G. S. Cargill III, and C.-K. Hu, Mater. Res. Soc. Symp. Proc. 612, D1.8.1 (2000).
9. P.-C. Wang, I. C. Noyan, S. K. Kaldor, J. L. Jordan-Sweet, E. G. Liniger, and C.-K. Hu, Appl. Phys. Lett. 78, 2712 (2001).
10. Y.-J. Park, V. K. Andleigh, and C. V. Thompson, J. Appl. Phys. 85, 3546 (1999).
11. 2Cu precipitates and that the delay before onset of Al migration is "roughly proportional to Cu concentration."
12. M. A. Korhonen, T. Liu, D. D. Brown, and C.-Y. Li, Mater. Res. Soc. Symp. Proc. 391, 411 (1995).
13. H. S. Rathore, R. G. Filippi, R. A. Wachnik, J. J. Estabil, and T. Kwok. Proc. SPIE 1805, 251 (1991).
14. C.-K. Hu, P. S. Ho, and M. B. Small, J. Appl. Phys. 72, 291 (1992).
15. D. T. Carpenter, M. Watanabe, K. Barmak, and D. B. Williams, Microsc. Microanal. 5, 254 (1999).
16. D. B. Williams, M. Watanabe, and D. T. Carpenter, Mikrochim. Acta, Suppl. 15, 49 (1998).
17. D. R. Frear, J. E. Sanchez, A. D. Romig, Jr., and J. W. Morris, Jr., Metall. Trans. A 21A, 2449 (1990).
18. C. M. Su, H. G. Bohn, K.-H. Robrock, and W. Schilling, J. Appl. Phys. 70, 2086 (1991).
19. I. A. Blech, J. Appl. Phys. 48, 473 (1977).
20. I. A. Blech and C. Herring, Appl. Phys. Lett. 29, 131 (1976).
21. P.-C. Wang, G. S. Cargill III, I. C. Noyan, and C.-K. Hu, Appl. Phys. Lett. 72, 1296 (1998).
22. H-K. Kao, Doctoral thesis, Columbia University (2000).
23. P.-C. Wang, G. S. Cargill III, I. C. Noyan, E. G. Liniger, C.-K. Hu, and K. Y. Lee, Mater. Res. Soc. Symp. Proc. 427, 35 (1996).
24. P.-C. Wang, Doctoral thesis, Columbia University (1997).
25. W. B. Pearson, A Handbook of Lattice Spacings and Structures of Metals and Alloys (Pergamon, Oxford U.K., 1958), p. 328.
26. M. A. Korhonen, R. D. Black, and C.-Y. Li, J. Appl. Phys. 69, 1748 (1991).
27. A. I. Sauter and W. D. Nix, IEEE Trans. Compon., Hybrids, Manuf. Technol. 1, 594 (1992).
28. H. B. Huntington, Solid Stale Phys. 7, 213 (1958).
29. P.-C. Wang, I. C. Noyan, S. K. Kaldor, J. L. Jordan-Sweet, E. G. Liniger, and C.-K. Hu, Appl. Phys. Lett. 76, 3726 (2000).
30. H. Kawasaki and C. K. Hu, 1996 Symposium on VLSI Technology (Hawaii), Digest of Technical Papers (IEEE, New York, 1996), p. 192.
31. T. M. Shaw, C.-K. Hu, K. Y. Lee, and R. Rosenberg, Appl. Phys. Lett. 67, 2296 (1995).
32. T. M. Shaw, C.-K. Hu, K. Y. Lee, and R. Rosenberg, Mater. Res. Soc. Symp. Proc. 428, 187 (1996).
33. J. P. Dekker, C. A. Volkert, E. Arzt, and P. Gumbsch, Phys. Rev. Lett. 87, 035901 (2001).
34. H.-K. Kao, G. S. Cargill III, K. J. Hwang, A. C. Ho, P.-C. Wang, and C.-K. Hu, Mater. Res. Soc. Symp. Proc. 563, 163 (1999).
35. R. Spolenak, N. Tamura, B. C. Valek, A. A. MacDowell, R. S. Celestre, H. A. Padmore, W. L. Brown, T. Marieb, B. W. Batterman, and J. R. Patel, in Stress Induced Phenomena in Metallization: Sixth International Workshop, edited by S. P. Baker, M. A. Korhonen, E. Arzt, and P. S. Ho (AIP, Melville, NY, 2002), p. 217.