Compact thermal models of conduction cooled packages

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1999, Pages 221-230

  Ortega, Alfonso ^a   Aranyosi, Attila ^a   Griffin, Robert A ^a   West, Sid ^a   Edwards, Darvin ^a  

^a UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SOFTWARE; ELECTRIC NETWORK TOPOLOGY; GENETIC ALGORITHMS; HEAT CONDUCTION; HEAT RESISTANCE; MATHEMATICAL MODELS; OPTIMIZATION; SEMICONDUCTOR JUNCTIONS;

NONLINEAR GLOBAL OPTIMIZATION;

ELECTRONICS PACKAGING;

EID: 0032630150     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)