Development of component-level thermal models of a ceramic pin grid array

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 512-519

  Pashaie Rad, Sepideh ^a   Hermanson, James C ^a   Rencis, Joseph J ^a  

^a Flomerics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; BOUNDARY CONDITIONS; CALCULATIONS; COMPUTATIONAL FLUID DYNAMICS; HEAT SINKS; MATHEMATICAL MODELS; WIND TUNNELS;

CERAMIC PIN GRID ARRAY; JUNCTION TO AMBIENT THERMAL RESISTANCE; JUNCTION TO CASE THERMAL RESISTANCE;

ELECTRONICS PACKAGING;

EID: 0031625151     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)