Reduced thermal models of electronic packages for system level design applications

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 75-78

  Yu, E ^a   Przekwas, A ^a  

^a CFD RESEARCH CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345771797     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)

1. Bar-Cohen, A. Elperin, T. and Eliai, R., 1989. "Θja Characterization of Chip Packages-Justification, Limitations, and Future", IEEE CPMT, Vol. 12, No. 4, pp.274-731
2. Bar-Cohen, A. and Krueger, W. B., 1997, "Thermal Characterization of Chip Packages-Evolutionary Development of Compact Models", IEEE CPMT, Vol. 20 No. 4, pp. 399-409.
3. Belady, C., 1998 Hewlett-Packard Company, Personal Discussions.
4. Furmanczyk, M. Napieraliski, A, Yu, E., Przekwas A., and Turowski, M., "Thermal Model Reduction for MCM packages", THERMINIC '98, France.
5. Kelkar, K., Radmehr, A. and Patankar, S., 1998, "Analysis of Flow Distribution in an Electronic Cabinet Using Computational Fluid Dynamics (CFD) and Flow Network Modeling (FNM)", ASME Congress, Anaheim, CA.
6. Lasance, C. J. M., Rosten, H., and Parry, J. D., 1997, "The World of Thermal Characterization According to DELPHI-Part II: Experimental and Numerical Methods", IEEE CPMT, Vol. 20, No. 4, pp. 392-398.
7. Vink, H. and Laseance, C. J. M. 1997, "Compact Models for Accurate Thermal Charcterization of Electronic Parts", IEEE CPMT, Vol. 20, No. 4, pp. 411-419.