Numerical prediction of electronic component heat transfer: An industry perspective

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2003, Pages 14-26

  Eveloy, Valérie ^a,b   Rodgers, Peter ^a   Hashmi, M S J ^b  

^a Electronics Thermal Management Ltd   (Ireland)

^b DUBLIN CITY UNIVERSITY   (Ireland)

Author keywords

Benchmark; CFD; Component; Electronics cooling; Modeling; PCB; Prediction; Reliability; Virtual prototyping

Indexed keywords

COMPONENTS; COMPUTATIONAL FLUID DYNAMICS; ELECTRONIC EQUIPMENT; FLOW OF FLUIDS; PRINTED CIRCUIT BOARDS; PRODUCT DESIGN; RAPID PROTOTYPING; RELIABILITY; TEMPERATURE; THERMOANALYSIS; VELOCITY MEASUREMENT; VIRTUAL REALITY; AIR; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; FLOW MEASUREMENT; HEAT TRANSFER; NON NEWTONIAN LIQUIDS; PRINTED CIRCUITS; TEMPERATURE DISTRIBUTION; THERMAL VARIABLES MEASUREMENT;

COMPONENT JUNCTION TEMPERATURE; ELECTRONIC COMPONENT; ELECTRONICS COOLING;

HEAT TRANSFER; COMPUTATIONAL FLUID DYNAMICS;

ACCURACY; COMPONENT JUNCTION TEMPERATURE; COMPUTATIONAL FLUIDS DYNAMICS; ELECTRONIC COMPONENT; NUMERICAL PREDICTIONS; PRINTED CIRCUIT BOARDS (PCB); RELIABILITY PREDICTION; TEMPERATURE DEPENDENCE;

EID: 0037275702     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (35)

1. Shapiro, B., "Creating Reduced-Order Models for Ekectronic Systems: An Overview and Suggested Use of Existing Model Reduction and Experimental System Verification Tools," Proc of the International Conference on Thermal Challenges in Next Generation Electronic Systems (Thermes 2002), pp. 299-306, 2002.
2. Rodgers, P., "An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer," Ph.D. Thesis, Department of Mechanical & Aeronautical Engineering, University of Limerick, Limerick, Ireland, 2000.
3. Lasance, C. J. M., "The conceivable Accuracy of Experimental and Numerical Thermal Analysis of Electronic Systems," Proc of 17th IEEE Semiconductor Thermal Measurement and Management Symp (Semi-Therm XVII), pp.180-198, 2001.
4. Lasance, J. M., 1995, "The need for a change in Thermal Design Philosophy," Electronics Cooling, Vol. 1, No. 2, pp. 24-26.
5. Lasance, C. J. M., Rosten, H., and Parry, J., "The World of Thermal Characterization According to DELPHI-Parts I and II: Experimental and Numerical Methods", IEEE Trans. on Components, Packaging & Mfg. Technology, Part A, Vol. 20, No.4, pp. 392-398, 1997.
6. Aranyosi, A., Ortega, A., Griffin, R. A., West, S., and Edwards, D., "Compact Thermal Models of Packages used in Conduction Cooled Applications," IEEE Trans on Components and Packaging Technology (CPT), Vol. 23, No. 3, pp. 470-480, 2000.
7. Bosch, E. G. T., "Thermal Compact Models: An Alternative Approach," Proc of 7th International Workshop on Thermal Investigations of ICs and Systems (Therminic), Paris, France, September 24-27, pp. 197-202, 2001.
8. Gerstenmaier, Y. C., Pape, H., and Wachutka, G., "Rigorous Model and Network for Static Thermal Problems," Proc of 7th International Workshop on Thermal Investigations of ICs and Systems (Therminic), Paris, France, September 24-27, pp. 203-208, 2001.
9. Sabry, M. N., "Compact Thermal Models for Electronic Systems," Proc of 7th International Workshop on Thermal Investigations of ICs and Systems (Therminic), Paris, France, September 24-27, pp. 197-202, 2001.
10. Boyalakuntla, D. S., and Murthy, J. Y., "COBRA-Based Compact Models for Simulation of Electronic Chip Packages", Proc of The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition (IPACK'01), July 8-13, 2001, Kauai, Hawaii, USA, Paper Number IPACK2001-15534, 2001.
11. Rodgers, P., "Thermal Modeling of Microelectronics," Proc of 4th Thermal & Mechanical Simulation and Experiments in Micro-electronics and Microsystems Conference (EuroSimE 2003), 2003.
12. Tang, L. and Joshi, Y. K., "A Multi-Scale Conjugate Thermal Modeling Approach for Air Cooled Electronic Enclosures," Advances in Electronic Packaging; Proc of The Pacific RIM/ASME International Intersociety Electronic & Photonic Packaging Conference (InterPACK'99), EEP-Vol. 26-1, pp. 295-304, 1999.
13. Grimes, R., Davies, M., Punch, J., Dalton, T., and Cole, R., "Modeling Electronic Cooling Axial Fan Flows," Trans of the ASME, Journal of Electronic packaging, Vol. 123, No. 2, pp. 112-119, 2001.
14. Eveloy, V., Lohan, J., and Rodgers, P., "A Benchmark Study of Computational Fluid Dynamics Predictive Accuracy for Component-Printed Circuit Board Heat Transfer," IEEE Trans on Components and Packaging Technology (CPT), Vol. 23, No. 3, pp. 568-577, 2000.
15. Rodgers, P., Eveloy, V., and Davies, M., "An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection: Parts I and II," Trans of the ASME, Journal of Electronic Packaging, Vol. 125, No. 1, 2003.
16. Rodgers, P., Eveloy, V., Lohan, J., Fager, C.M., Tiilikka, P., and Rantala, J., "Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments," Proc of 15th IEEE Semiconductor Thermal Measurement and Management Symp (Semitherm XV), pp. 55-64, 1999.
17. Rodgers, P., Lohan, J., Eveloy, V., Fager, C.M., and Rantala, J., "Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Air Flows by Experimental Analysis," Advances in Electronic Packaging; Proc of The Pacific RIM/ASME International Intersociety Electronic & Photonic Packaging Conference (InterPACK'99), EEP-Vol. 26-1, pp. 999-1009, 1999.
18. Lohan, J., Eveloy, V., and Rodgers, P., "Visualization of Forced Air Flows over a Populated Printed Circuit Board and their Impact on Convective Heat Transfer," Proc of 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM 2002), pp. 501-511, 2002.
19. Eveloy, V., PhD thesis, to be submitted to Dublin City University, Ireland, 2003.
20. Lohan, J., and Davies, M., "Thermal Interaction Between Electronic Components", 31st ASME National Heat Transfer Conference, HTD-329, Vol. 7, pp. 73-82, 1996.
21. Eveloy, V., Rodgers P., and Hashmi, M. S. J., "Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted PQFP Components in Free Convection," in review and possible publication in the Trans of the ASME, Journal of Electronic Packaging, 2003.
22. Flotherm, Version 3.2 Reference and User Manuals, Flomerics Limited, Bridge Road, Hampton Court, Surrey, KT8 9HH, United Kingdom, 2001.
23. Rosten, H., Parry, J. Addison, R. Viswanath, M. Davies, and E. Fitzgerald, "Development, Validation and Application of a Thermal Model of a PQFP", Proc of 45th ECTC, pp. 1140, 1995.
24. Eveloy, V., Rodgers, P., and Lohan, J., "Comparison of Numerical Predictions and Experimental Measurements for the Transient Thermal Behavior of a Board-Mounted Electronic Component," Proc of 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM'02), pp. 36-45, 2002.
25. Ferziger, J., H., and Peric, M., "Computational Methods for Fluid Dynamics," Springer, (Berlin, 1997), pp. 276-279.
26. Anderson, A., "A Comparison of Computational and Experimental Results for Flow and Heat Transfer from an Array of Heated Blocks", Trans of the ASME, Journal of Electronic Packaging, Vol. 119, March, pp. 32-39, 1997.
27. Grimes, R., Kehoe, E., and Davies, M., "Experimental and Numerical Investigation of Mixed Convection Flow over a Horizontal Cylinder and a PCB," Proc of 7th International Workshop on Thermal Investigations of ICs and Microstructures (Therminic), pp. 83-86, 2001.
28. Meinders, E.R., "Experimental Study of Heat Transfer in Turbulent Flows over Wall-Mounted Cubes," Ph.D. Thesis, Faculty of Applied Physics, Delft University of Technology, The Netherlands, pp. 19-36, 1998.
29. Cole, R., Dalton, T., Punch, J., Davies, M. R., and Grimes, R., "A Thermal Design Methodology for Electronic Systems - Part I: Board and Component Level," Proc of 33rd ASME National Heat Transfer Conference, NHTD99-152, 1999.
30. Behnia, M., Nakayama, W., and Wang, J., "CFD Simulations of Heat Transfer from a Heated Module in an Air Stream: Comparison with Experiments and a Parametric Study," Proc of 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '98), pp. 143-151, 1998.
31. Nakayama, W., "Emerging New Roles of CFD Simulation in Competitive Market Environment," Proc of 7th International Workshop on Thermal Investigations of ICs and Systems (Therminic), pp. 223-229, 2001.
32. Nakayama, "An Approach to Fast Thermal Design of Compact Electronic Systems: a JSME Project," Advances in Electronic Packaging; Proc of The Pacific RIM/ASME International, Intersociety Electronic Packaging Technical/Business Conference & Exhibition (IPACK'01), Paper No. IPACK2001-15532, 2001.
33. Azar, K., and Rodgers, P., "Visualization of Air Flows in Electronic Systems," Electronics Cooling, Vol. 7, No. 2, pp. 26-33, 2001.
34. Tatchell, T., "Grid Systems for CFD and Their Application to Electronics Thermal Analysis," Flomerics Limited, Bridge Road, Hampton Court, Surrey, KT8 9HH, United Kingdom, 1998.
35. Eveloy, V., Rodgers, P., DeVoe, J., Ortega, A., and Hashmi, M.S.J., "An Experimental Assessment of Compact Thermal Models for Board-Mounted Electronic Component Heat Transfer," Proc of 19th IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm XIX), 2003.