Comparison of numerical predictions and experimental measurements for the transient thermal behavior of a board-mounted electronic component

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 36-45

  Eveloy, Valérie ^a,b   Rodgers, Peter ^a   Lohan, John ^b  

^a Westport Co   (Ireland)

^b Atlantic Technological University Sligo   (Ireland)

Author keywords

Benchmark; CFD; Component; Computational Fluids Dynamics; Electronics cooling; Heat transfer; Modeling; Prediction; Reliability; Thermal management; Transient; Validation; Virtual prototyping

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; HEAT LOSSES; MOUNTINGS; PRINTED CIRCUIT BOARDS; RELIABILITY; STRESS ANALYSIS; THERMOANALYSIS; THERMOGRAPHY (TEMPERATURE MEASUREMENT); TRANSIENTS;

ELECTRONIC COMPONENTS;

HEAT TRANSFER;

EID: 0036459515     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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