Numerical heat transfer predictive accuracy for an in-line array of board-mounted PQFP components in forced convection

Advances in Electronic Packaging

Volumn 1, Issue , 2001, Pages 437-447

  Eveloy, Valérie C ^a   Rodgers, Peter J ^b   Lohan, John M ^a  

^a Atlantic Technological University Sligo   (Ireland)

^b Advanced Thermal Solutions Inc   (United States)

Author keywords

Benchmarking; CFD; Component heat transfer; Computational fluid dynamics; Electronics cooling; Electronics thermal management; Numerical analysis; Predictive accuracy

Indexed keywords

BENCHMARKING; COMPUTATIONAL FLUID DYNAMICS; COOLING; FORCED CONVECTION; LAMINAR FLOW; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; NUMERICAL ANALYSIS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR JUNCTIONS; THERMAL EFFECTS; THERMOGRAPHY (IMAGING); TURBULENCE;

ELECTRONICS COOLING; ELECTRONICS THERMAL MANAGEMENT; JUNCTION TEMPERATURE; PREDICTIVE ACCURACY;

NETWORK COMPONENTS;

EID: 0346308515     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (37)

1. Moore, G. E., 1975, "Progress in Digital Integrated Electronics," IEEE International Electron Meeting, pp. 11-13.
2. Azar, K., 1999, Editorial, Electronics Cooling, Vol. 5, No. 3, pp. 1.
3. Lall, P., Pecht, M., and Harkim, E., 1997, Influence of Temperature on Microelectronics and System Reliability, CRC Press, New York.
4. Bar-Cohen, A., 1999, "Thermal Packaging for the 21st Century: Challenges and Options," Invited talk given at the Fifth International Workshop on Thermal Investigations of ICs and Microstructures (THERMINIC), October 3-6, Rome, Italy.
5. Prakash, C., 1990, "Application of Computational Fluid Dynamics for Analyzing Practical Electronic Cooling Problems," Heat Transfer in Electronic and Microelectronic Equipment, Editor, Bergles, A. E., Hemisphere, New York.
6. Lee, T., Chambers, B., and Mahalingam, M., 1994, "Application of CFD Technology to Electronic Thermal Management", Proceedings of the 44th Electronics Components and Technology Conference, pp. 411-420.
7. Lasance, C. J. M., 1997, "Status and Challenges in Thermal Design of Electronic Parts and Systems," Proceedings of EUROTHERM Seminar 58: Thermal Management of Electronic Systems III, Editors, Bardon, J. P., Beyne, E., Saulnier, J. B., Elsevier, Paris, pp. 91-107.
8. Hutchings, B., and Iannuzzeli, R., 1987, "Taking the Measure of Fluid Dynamics Software," Mechanical Engineering, May Edition, pp.72-76.
9. Rodgers, P., 2000, "An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer," Ph.D. Thesis, Department of Mechanical & Aeronautical Engineering, University of Limerick, Limerick, Ireland.
10. Lasance, J. M., 1995, "The need for a change in Thermal Design Philosophy," Electronics Cooling, Vol. 1, No. 2, pp. 24-26.
11. Nakayama, W., and Bergles, A. E., 1990, "Cooling Electronic Equipment: Past, Present and Future," in: Heat Transfer in Electronic and Microelectronic Equipment, Editor, Bergles, A. E., Hemisphere, New York, pp. 3-40.
12. H. Rosten, J. Parry, J. Addison, R. Viswanath, M. Davies, and E. Fitzgerald, 1995, "Development, Validation and Application of a Thermal Model of a PQFP", Proceedings of the 45th ECTC, pp. 1140.
13. Adams, V., Blackburn, D., Joshi, Y., and Berning, D., 1997, "Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronics Systems", IEEE Transactions on CPMT-Part A, 20, No. 4, pp. 420-431.
14. Zahn, B. A., 1998, "Evaluating Thermal Characterisation Accuracy Using CFD Codes - A Package Level Benchmark Study of IcePaK and Flotherm", Proceedings of the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 322-329.
15. Chiriac, V. A., and Lee, T-Y. T., 1999, "Thermal Strategy for Modelling The Wirebonded PBGA Packages," Advances in Electronic Packaging; Proceedings of The PACIFIC RIM/ASME International Intersociety Electronic & Photonic Packaging Conference (InterPACK'99), EEP-Vol. 26-1, pp. 287-293.
16. Rosten, H. I. and Viswanath, R., 1994, "Thermal Modelling of the Pentium™ Processor Package", Proceedings of the 44th Electronics Components and Technology Conf., pp. 1140-1150.
17. Burgos, J., Manno, V. P., and K. Azar, 1995, "Achieving Accurate Thermal Characterisation Using a CFD Code - A Case Study of Plastic Packages," IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, 18, No. 4, pp. 732-738.
18. S. Teng, T.-Y. T. Lee, M. Mahalingam, and B. Joiner, 1997, "Thermal Model of a Component Package for System Level Applications", Journal of Electronics Manufacturing, 7, No.2, pp. 115-127.
19. Ramakrishna, K., Thomas, T. R., Lee, T.-Y. T., Trent, J. R., and Hause, J. V., 1998," Thermal Performance of an Air-Cooled Plastic Ball Grid Array Package in Natural and Forced Convection," Proceedings of the Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM'98), pp.27-34.
20. Rodgers, P., Eveloy, V., Lohan, J., Fager, C.M., Tiilikka, P., and Rantala, J., 1999, "Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in Natural Convection Environments," Proceedings of the Fifteenth IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM XV), pp. 55-64.
21. Rodgers, P., Eveloy, V., Lohan, J., Fager, C.M., and Rantala, J., 1999, "Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in a Forced Convection Environment: Part I - Experimental and Numerical Modelling," 33rd ASME National Heat Transfer Conference, NHTD99-167.
22. Rodgers, P., Eveloy, V., Lohan, J., Fager, C.M., and Rantala, J., 1999, "Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in a Forced Convection Environment: Part II -Results and Discussion," 33rd ASME National Heat Transfer Conference, NHTD99-325.
23. Eveloy, V., Lohan, J., and Rodgers, P., 2000, "A Benchmark Study of Computational Fluid Dynamics Predictive Accuracy for Component-Printed Circuit Board Heat Transfer," IEEE Transactions on Components and Packaging Technology (CPT), 23, No. 3, pp.568-577.
24. Behnia, M., and Nakayama, W., 1998, "Numerical Simulation of Combined Natural Convection-Conduction Cooling of Multiple Protuding Chips on a Series of Parallel Sunbstrates," Proceedings of The Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM '98), pp. 135-142.
25. Andersen, A., 1997, "A Comparison of Computational and Experimental Results for Flow and Heat Transfer from an Array of Heated Blocks", Transactions of the ASME, Journal of Electronic Packaging, 119, March, pp. 32-39.
26. Drabbels, J. P. A., 1995, "Natural Convection Heat Transfer of Metal Cuboids Flush Mounted in a Horizontal Plate," Proceedings of EUROTHERM Seminar 45: Thermal Management of Electronic Systems II, Editors, Beyne, E., Lasance C. J. M., and Berghmans, J., Kluwer Academic Publishers, Dordrecht, pp. 273-280.
27. rd ASME National Heat Transfer Conference, NHTC99-311.
28. Rodgers, P., Lohan, J., Eveloy, V., Fager, C.M., and Rantala, J., 1999, "Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Air Flows by Experimental Analysis," Advances in Electronic Packaging; Proceedings of The PACIFIC RIM/ASME International Intersociety Electronic & Photonic Packaging Conference (InterPACK'99), EEP-Vol. 26-1, pp. 999-1009.
29. Mack, B., and Venus, T., 2000, "Thermal Challenges in the Telecom and Networks Industry," Electronics Cooling, Vol 6, No. 2, pp. 44-49.
30. Lohan, J., and Davies, M., 1996, "Thermal Interaction Between Electronic Components", 31st ASME National Heat Transfer Conference, HTD-329, Vol. 7, pp. 73-82.
31. nd ASME National Heat Transfer Conference, HTD-343, Vol. 5, pp. 73-82.
32. SEMI International Standards, 1994, "Guideline for unencapsulated Thermal Test Chip," SEMI International Standards, Packaging Volume.
33. SEMI International Standards, 1992, "G38-87 Test Method -Still- and Forced Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages", SEMI International Standards, Packaging Volume, pp. 173-177.
34. Lohan, J., and Davies, M., 1994, "Transient Thermal Behaviour of a Board-Mounted 160-Lead Plastic Quad Flat Pack," Proceedings of the Fourth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM'94), pp. 108-116.
35. Flotherm, 2000, Version 3.1 Reference and User Manuals, Flomerics Limited, Bridge Road, Hampton Court, Surrey, KT8 9HH, United Kingdom.
36. Tucker, P. G., 1997, "CFD Applied to Electronic Systems: A Review", IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, 20, No. 4, pp. 518-529.
37. Azar, K., and Graebner, J. E., 1996, "Experimental Determination of Thermal Conductivity of Printed Wiring Boards", Proceedings of the Twelfth IEEE SEMI-THERM Symposium (SEMI-THERM XII), pp. 169-182.