Evolution of surface morphologies in sputtered and electroplated Cu films during thermal cycling

Materials Science Forum

Volumn 408-412, Issue II, 2002, Pages 1651-1656

  Hwang, Soo Jung ^a   Park, Hyun ^a   Lee, Je Hun ^a   Oh, Kyu Hwan ^a   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

Author keywords

Copper; Electroplating; Sputtering; Stress Voiding; Texture; Thin Film

Indexed keywords

ANNEALING; COPPER; ELECTROPLATING; GRAIN BOUNDARIES; MORPHOLOGY; SPUTTERING; SURFACES; TEXTURES; THERMAL CYCLING;

LOW ENERGY BOUNDARIES;

METALLIC FILMS;

EID: 0037001875     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.408-412.1651     Document Type: Conference Paper

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