Conductive adhesive materials for lead solder replacement. II

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 351-355

  Suzuki, O ^a   Komagata, M ^a   Suzuki, K ^a  

^a NAMICS CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVES; BOND STRENGTH (MATERIALS); COATINGS; CONTACT RESISTANCE; FRACTURE MECHANICS; JOINING; MANUFACTURE; SOLDERING ALLOYS;

CONDUCTIVE ADHESIVE; HIGH TEMPERATURE STORAGE; INTERMETALLIC LAYER; ISOTROPIC CONDUCTIVE ADHESIVES; LEAD CONTAINING SOLDERS; RELIABILITY TESTING; SILVER-FILLED ADHESIVES; STRENGTH DEGRADATION;

CONDUCTIVE MATERIALS;

EID: 84962291686     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742052     Document Type: Conference Paper

References (7)

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