Transient liquid phase sintering composites: Polymer adhesives with metallurgical bonds

Journal of Electronic Materials

Volumn 28, Issue 11, 1999, Pages 1319-1326

  Shearer, Catherine ^a   Shearer, Bryan ^a   Matijasevic, Goran ^a   Gandhi, Pradeep ^a  

^a Ormet Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; CHEMICAL BONDS; CONDUCTIVE PLASTICS; ELECTRIC RESISTANCE; INTERPENETRATING POLYMER NETWORKS; SINTERING;

SOLDER PASTES; TRANSIENT LIQUID PHASE SINTERING COMPOSITES;

PLASTIC ADHESIVES;

EID: 0033221458     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0174-z     Document Type: Article

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