Gull-wing solder joint fatigue life sensitivity evaluation

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 3, 1997, Pages 171-176

  Wong, T E ^a   Tierney, B D ^b  

^a RAYTHEON COMPANY   (United States)

^b MacNeaI Schwendler Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED ANALYSIS; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; STATISTICAL METHODS; SURFACE MOUNT TECHNOLOGY;

GULL WING SOLDER JOINT ASSEMBLY; TAGUCHI APPROACH;

SOLDERED JOINTS;

EID: 0031233477     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792230     Document Type: Article

References (13)

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13. Wong, B., Helling, D. E., and Clark, R. W., “A Creep-Rupture Model for Two-Phase Eutectic Solders,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 11, No. 3, pp. 284-290, 1988