Reliability performance and failure mode of high I/O thermally enhanced ball grid array packages

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1998, Pages 323-332

  Coyle, R J ^a   Ejim, T I ^a   Holliday, A ^a   Solan, P P ^a   Dorey, J K ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; CRACKS; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; INDUSTRIAL ELECTRONICS; RELIABILITY; SOLDERED JOINTS; TELECOMMUNICATION INDUSTRY;

ACCELERATED THERMAL CYCLING; BRITTLE FRACTURE MECHANISM; LONG-TERM RELIABILITY TESTING; PHENOMENOLOGICAL APPROACH; RELIABILITY PERFORMANCE; RELIABILITY REQUIREMENTS; TELECOMMUNICATIONS INDUSTRY; THERMALLY ENHANCED BALL GRID ARRAYS;

BALL GRID ARRAYS;

EID: 0001958112     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.1998.731089     Document Type: Conference Paper

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