Solder joint attachment reliability and assembly quality of a molded ball grid array socket

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1219-1226

  Coyle, R J ^a   Holliday, A ^a   Solan, P P ^a   Yao, C ^a   Cyker, H A ^a   Manock, J C ^a   Bond, R ^a   Stenerson, R E ^a   Furrow, R G ^a   Occhipinti, M V ^a   Gahr, S A ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ELECTROLYTIC POLISHING; EMBRITTLEMENT; FAILURE ANALYSIS; INTEGRATED CIRCUIT TESTING; METALLOGRAPHY; MOLDING; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; THERMAL EXPANSION;

BALL SHEAR TEST; ISOTHERMAL AGING; MOLDED BALL GRID ARRAY SOCKET; SOLDER INTERCONNECT; X RAY FLUORESCENCE;

ELECTRONICS PACKAGING;

EID: 0034835465     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927984     Document Type: Article

References (42)

1. Trends in IC packaging and advanced assembly
2. Worldwide packaging trends for portable products
3. Trends in advanced component technologies
4. Electronics packaging technology update: BGA, CSP, DCA, and flip chip
5. Meeting market demands new and critical technologies for electronic packaging and assembly
6. Packaging technologies for RFICs: Current status and future trends
7. High reliability telecommunications equipment: A tall order for chip-scale packages
8. An analytical comparison of the thermal performances of various ball grid array packaging technologies
9. Advanced IC packaging for future applications
10. The expanding BGA menu - Comparison and direction of the exploding technology
11. BGA sockets - A dendritic solution
12. Performance drivers for fine-pitch BGA sockets
13. Overlooked infrastructure: Sockets and connectors
14. Attaching BGA devices
15. Solder attachment reliability, accelerated testing, and result evaluation
16. Designed experiment to determine attachment reliability drivers for PBGA packages
17. Socket adapter systems simplify BGA assembly
18. A brief introduction to ball grid array technologies
19. No clean mass reflow of large overmolded plastic pad carrier arrays
20. Case studies of brittle interfacial failures in area array solder interconnects
21. Brittle interfacial fracture of PBGA packages on electroless Ni/immersion Au
22. Interfacial fracture mechanism of BGA packages on electroless Ni/Au
23. Effect of thermal aging on the microstructure and reliability of Ball Grid Array (BGA) solder joints
24. The expanding BGA menu - Comparison and direction of the exploding technology
25. The influence of nickel/gold surface finish on the assembly quality and long term reliability of thermally enhanced BGA packages
26. Instrumentation
27. Thinking globally, measuring locally - Can a two-tier flatness specification provide relief?
28. Design and assembly process implementation for BGAs
29. Outline drawing for plastic BGA
30. The influence of test parameters and package design features on ball shear test requirements
31. The influence of room temperature aging on ball shear strength and microstructure of area array solder balls
32. Test method for ball shear test
33. Solder joint reliability of plastic Ball Grid Array
34. Electroless nickel-gold: Is there a future?
35. Goldwire bondable and solderable surfaces
36. Ball attachment evaluation for tape Ball Grid Array packages
37. A root cause failure mechanism for solder joint integrity of electroless nickel/immersion gold surface finishes
38. Preparation, structures, and fracture modes of Pb-Sn and Pb-In terminated flip-chip attached to gold capped microsockets
39. Shear testing and failure mode analysis for evaluation of BGA ball attachment
40. Assembly and reliability of thermally enhanced high I/O BGA packages
41. Plastic BGA solder joint reliability considerations
42. Reliability performance and failure mode of high I/O thermally enhanced Ball Grid Array packages