Solder joint and runner metal reliability of wafer-level CSP(omega-CSP)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 87-92

  Kang, In Soo ^a   Kim, Jong Heon ^a   Park, I S ^a   Hur, Ki Rok ^a   Cho, Soon Jin ^a   Han, Hun ^a   Yu, Jin ^a  

^a Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; DYNAMIC RANDOM ACCESS STORAGE; ELASTIC MODULI; ELECTRON DEVICE MANUFACTURE; METALS; POLYMERS; RELIABILITY; SILICON WAFERS; SOLDERED JOINTS; SOLDERING;

DIELECTRIC POLYMER; MINIATURIZATION; RUNNER METAL RELIABILITY; SOLDER BALL SIZE; WAFER LEVEL CHIP SIZE PACKAGE;

CHIP SCALE PACKAGES;

EID: 0034481925     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)