Electronic systems packaging: Future reliability challenges

Microelectronics Reliability

Volumn 38, Issue 6-8, 1998, Pages 1277-1286

  Barrett, J ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; INTEGRATED CIRCUITS; MICROELECTRONICS; RELIABILITY;

ELECTRONIC SYSTEMS PACKAGING;

ELECTRONICS PACKAGING;

EID: 0032084107     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(98)00129-2     Document Type: Article

References (13)

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