Microriveting - a new wafer joining method

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1997, Pages 197-202

  Shivkumar, Bharat ^a   Kim, Chang Jin ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; FAILURE ANALYSIS; INTEGRATED CIRCUIT MANUFACTURE; NICKEL; RIVETING; SHEAR STRESS; SILICON WAFERS; SURFACE TREATMENT; TENSILE TESTING;

MICRORIVETING;

MICROELECTROMECHANICAL DEVICES;

EID: 0030672519     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)