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A mathematical model of pattern dependence in Cu CMP process
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T. Tugbawa, T. Park, D. Boning, T. Pan, P. Li, S. Hymes, T. Brown, and L. Camilletti, "A Mathematical Model of Pattern Dependence in Cu CMP Process", CMP Symposium in Electrochemical Society Meeting, Honolulu, HI. 1999, pp. 605-615.
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A two-dimensional low pass filter model for die-level topography variation resulting from chemical mechanical polishing of ILD films
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Washington, DC, Dec.
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T. Yu, S. Cheda, J. Ko, M. Roberton, A. Dengi, and E. Travis, "A Two-Dimensional Low Pass Filter Model for Die-Level Topography Variation Resulting from Chemical Mechanical Polishing of ILD Films", 1999 IEDM, Washington, DC, Dec. 1999.
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