-
1
-
-
84885423341
-
Effect of Fine-line Density and Pitch on Interconnect ILD Thickness Variation in Oxide CMP Process
-
R. R. DIVECHA, B. E. STINE, D. O. OUMA, J. U. YOON, D. S. BONING, J. E. CHUNG, O. S. NAKAGAWA, AND S. Y. OH, Effect of Fine-line Density and Pitch on Interconnect ILD Thickness Variation in Oxide CMP Process, in Proc. CMP-MIC, Santa Clara, February 1998.
-
Proc. CMP-MIC, Santa Clara, February 1998
-
-
Divecha, R.R.1
Stine, B.E.2
Ouma, D.O.3
Yoon, J.U.4
Boning, D.S.5
Chung, J.E.6
Nakagawa, O.S.7
Oh, S.Y.8
-
2
-
-
0003552056
-
-
SEE ALSO SIA, Semiconductor Industry Association, December
-
HTTP://WWW.ITRS.NET/. SEE ALSO SIA, The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, December 1997.
-
(1997)
The National Technology Roadmap for Semiconductors
-
-
-
3
-
-
0031678747
-
Filling and Slotting: Analysis and Algorithms
-
A. B. KAHNG, G. ROBINS, A. SINGH, H. WANG, AND A. ZELIKOVSKY, Filling and Slotting: Analysis and Algorithms, in Proc. International Symposium on Physical Design, Monterey, CA, April 1998, pp. 95-102.
-
Proc. International Symposium on Physical Design, Monterey, CA, April 1998
, pp. 95-102
-
-
Kahng, A.B.1
Robins, G.2
Singh, A.3
Wang, H.4
Zelikovsky, A.5
-
4
-
-
0032712949
-
New and Exact Filling Algorithms for Layout Density Control
-
A. B. KAHNG, G. ROBINS, A. SINGH, AND A. ZELIKOVSKY, New and Exact Filling Algorithms for Layout Density Control, in Proceedings of the 12th International Conference on VLSI Design, Goa, India, 1999, pp. 106-110.
-
Proceedings of the 12th International Conference on VLSI Design, Goa, India, 1999
, pp. 106-110
-
-
Kahng, A.B.1
Robins, G.2
Singh, A.3
Zelikovsky, A.4
-
5
-
-
34748878741
-
New Multi-Level and Hierarchical Algorithms for Layout Density Control
-
A. B. KAHNG, G. ROBINS, A. SINGH, AND A. ZELIKOVSKY, New Multi-Level and Hierarchical Algorithms for Layout Density Control, in Proceedings of the Asia and South Pacific Design Automation Conference, Hong Kong, China, 1999, pp. 221-224.
-
Proceedings of the Asia and South Pacific Design Automation Conference, Hong Kong, China, 1999
, pp. 221-224
-
-
Kahng, A.B.1
Robins, G.2
Singh, A.3
Zelikovsky, A.4
-
6
-
-
0032638509
-
Filling Algorithms and Analyses for Layout Density Control
-
A. B. KAHNG, G. ROBINS, A. SINGH, AND A. ZELIKOVSKY, Filling Algorithms and Analyses for Layout Density Control, IEEE Trans. Computer-Aided Design, 18 (1999), pp. 445-462.
-
(1999)
IEEE Trans. Computer-Aided Design
, vol.18
, pp. 445-462
-
-
Kahng, A.B.1
Robins, G.2
Singh, A.3
Zelikovsky, A.4
-
7
-
-
0026943966
-
Integration of Chemical-Mechanical Polishing into CMOS Integrated Circuit Manufacturing
-
H. LANDIS, P. BURKE, W. COTE, W. HILL, C. HOFFMAN, C. KAANTA, C. KOBURGER, W. LANGE, M. LEACH, AND S. LUCE, Integration of Chemical-Mechanical Polishing into CMOS Integrated Circuit Manufacturing, Thin Solid Films, 220 (1992), pp. 1-7.
-
(1992)
Thin Solid Films
, vol.220
, pp. 1-7
-
-
Landis, H.1
Burke, P.2
Cote, W.3
Hill, W.4
Hoffman, C.5
Kaanta, C.6
Koburger, C.7
Lange, W.8
Leach, M.9
Luce, S.10
-
10
-
-
0032028732
-
The Physical and Electrical Effects of Metal-fill Patterning Practices for Oxide Chemical-Mechanical Polishing Processes
-
B. E. STINE, D. S. BONING, J. E. CHUNG, AND L. CAMILLETTI, The Physical and Electrical Effects of Metal-fill Patterning Practices for Oxide Chemical-Mechanical Polishing Processes, IEEE Transactions on Electron Devices, 45 (1998), pp. 665-679.
-
(1998)
IEEE Transactions on Electron Devices
, vol.45
, pp. 665-679
-
-
Stine, B.E.1
Boning, D.S.2
Chung, J.E.3
Camilletti, L.4
-
11
-
-
37249019069
-
-
Tech. Rep. 9-19, University of Texas at Austin CS Dept.
-
R. TIAN, D. WONG, R. BOONE, AND A. REICH, Dummy Feature Placement for Oxide Chemical-Mechanical Polishing Manufacturability, Tech. Rep. 9-19, University of Texas at Austin CS Dept., 1999.
-
(1999)
Dummy Feature Placement for Oxide Chemical-Mechanical Polishing Manufacturability
-
-
Tian, R.1
Wong, D.2
Boone, R.3
Reich, A.4
-
12
-
-
0031173556
-
-
Solid State Technology
-
M. TOMOZAWA, Oxide CMP Mechanisms, Solid State Technology, (1997), pp. 169-175.
-
(1997)
Oxide CMP Mechanisms
, pp. 169-175
-
-
Tomozawa, M.1
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