Hierarchical dummy fill for process uniformity

Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Volumn 2001-January, Issue , 2001, Pages 139-144

  Chen, Yu ^a   Kahng, A B ^b   Robins, G ^c   Zelikovsky, A ^d  

^a University of California   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c University of Virginia   (United States)

^d GEORGIA STATE UNIVERSITY   (United States)

Author keywords

Capacitance; Chemical vapor deposition; Computational geometry; Computer aided manufacturing; Computer science; Copper; Etching; Filling; Process control; Proximity effect

Indexed keywords

CAPACITANCE; CHEMICAL VAPOR DEPOSITION; COMPUTATIONAL GEOMETRY; COMPUTER AIDED DESIGN; COMPUTER AIDED MANUFACTURING; COMPUTER SCIENCE; COPPER; ETCHING; FILLING; GEOMETRY; LINEAR PROGRAMMING;

DATA VOLUME; LARGE DATA VOLUMES; LINEAR PROGRAMS; MANUFACTURABILITY; OUTPUT DATA; PROCESS UNIFORMITY; PROXIMITY EFFECTS; SOLUTION QUALITY;

PROCESS CONTROL;

EID: 0001621340     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASPDAC.2001.913294     Document Type: Conference Paper

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