Advances in process overlay on 300 mm wafers

Proceedings of SPIE-The International Society for Optical Engineering

Volumn 4689 II, Issue , 2002, Pages 927-936

  Staecker, Jens ^a   Arendt, Stefanie ^a   Schumacher, Karl ^a   Mos, Evert ^b   Van Haren, Richard ^b   Van Der Schaar, Maurits ^b   Edart, Remi ^b   Demmerle, Wolfgang ^b   Tolsma, Hoite ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b ASML   (Netherlands)

Author keywords

300 mm wafer processing; Alignment systems; CMP; Overlay; Process overlay; Resist spin effects; STI

Indexed keywords

ANTIREFLECTION COATINGS; FREQUENCIES; LASERS; OPTICAL SENSORS; SPURIOUS SIGNAL NOISE;

RESIST SPIN EFFECTS; WAFER PROCESSING;

LITHOGRAPHY;

EID: 0036030173     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.473421     Document Type: Article

References (8)

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