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Volumn 3998, Issue , 2000, Pages 428-440
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Overlay performance on tungsten CMP layers using the ATHENA alignment system
a a a a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL POLISHING;
DEPOSITION;
INTEGRATED CIRCUIT LAYOUT;
MICROELECTRONICS;
SENSITIVITY ANALYSIS;
TUNGSTEN;
CHEMICAL MECHANICAL POLISHING (CMP);
METAL INTERCONNECT LAYERS;
LITHOGRAPHY;
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EID: 0033705455
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (10)
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References (7)
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