Modeling a via profile etched in a CHF3/CF4 plasma using a neural network

Journal of the Korean Physical Society

Volumn 41, Issue 4, 2002, Pages 433-438

  Kim, Byungwhan ^a   Kwon, Kwang Ho ^b   Kwon, Sung Ku ^c   Park, Jong Moon ^c   Yoo, Seong Wook ^c   Park, Kun Sik ^c   You, In Kyu ^c   Kim, Bo Woo ^c  

^a Sejong University   (South Korea)

^b Hanseo University   (South Korea)

^c Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

Experimental design; Oxide via etching; Profile neural networks

Indexed keywords

EID: 0035981409     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

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