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Volumn 178, Issue 1-4, 2001, Pages 140-148

XPS characterization of the interface between low dielectric constant amorphous fluoropolymer film and evaporation-deposited aluminum

(6) Ding, Shi Jin a Zhang, Qing Quang a Zhang, David Wei a Wang, Ji Tao a Zhou, Yong Dong b Lee, Wei William c

a FUDAN UNIVERSITY (China)

b SOOCHOW UNIVERSITY (China)

c TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (Taiwan)

Author keywords

Evaporation deposited aluminum; Low dielectric constant amorphous fluoropolymer; X ray photoelectron spectroscopy

Indexed keywords

ALUMINUM; AMORPHOUS FILMS; ANNEALING; CHEMICAL BONDS; DEPOSITION; DIELECTRIC FILMS; DIFFUSION IN SOLIDS; ETCHING; EVAPORATION; FLUIDITY; FLUORINE CONTAINING POLYMERS; INTERFACES (MATERIALS); PERMITTIVITY; REACTION KINETICS; X RAY PHOTOELECTRON SPECTROSCOPY;

AMORPHOUS FLUOROPOLYMERS;

PLASTIC FILMS;

EID: 0035796987 PISSN: 01694332 EISSN: None Source Type: Journal
DOI: 10.1016/S0169-4332(01)00313-0 Document Type: Article

Times cited : (20)

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