An improvement of conductive adhesives on high temperature endurance by using Ag-Sn alloy powder

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 265-269

  Yamashita, Munenori ^a   Suganuma, Katsuaki ^a   Komagata, Michinori ^b   Shirai, Yukio ^b  

^a OSAKA UNIVERSITY   (Japan)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; FILLERS; HIGH TEMPERATURE EFFECTS; PLATING; POWDER METALS; SILVER ALLOYS;

CONDUCTIVE ADHESIVES;

CONDUCTIVE MATERIALS;

EID: 0035791640     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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