Lead-free solder replacement: Beyond the material substitution

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4569, Issue , 2001, Pages 100-108

  Ciocci, Richard ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Component mismatch; Lead free solder; Moisture sensitivity; Obsolescence; Reflow temperatures

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; HEAT RESISTANCE; LEAD; MOISTURE; OBSOLESCENCE; PRINTED CIRCUIT BOARDS; SHEAR STRENGTH;

LEAD-FREE SOLDERS;

SOLDERING ALLOYS;

EID: 0035769906     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.455269     Document Type: Conference Paper

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