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Volumn 14, Issue 11, 2000, Pages
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Lead-free processing: thermal effect on components
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ACOUSTIC IMAGING;
DELAMINATION;
SOLDERING ALLOYS;
THERMAL EFFECTS;
ENCAPSULATING MATERIALS;
LEAD FREE PROCESSING;
THERMAL DAMAGE;
SURFACE MOUNT TECHNOLOGY;
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EID: 0011017843
PISSN: 08933588
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (1)
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References (0)
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