5 Steps to successful lead-free soldering: Step 3

Circuits Assembly

Volumn 12, Issue 6, 2001, Pages 42-48

  Diepstraten, Gerjan ^a  

^a Vitronics Soltec BV   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035370828     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

1. DeKlein, F.J. (1998). Statistical Process Control for Soldering. Oosterhout, The Netherlands: Vitronics Soltec.
2. Hall, W.J. (2000). Cooling Parameters in Reflow Soldering. Stratham, NH: Vitronics Soltec Corp.
3. Kelley, B., and Weisgerber, J. (2000). Step-by-Step SMT Process Control. SMT 2000.
4. Rooks, B. (2000). Robust Reflow Profile Design.
5. Suraski, D. Reflow Profiling, The Benefits of Implementing a Ramp-to-Spike Profile. AIM.