Editorial Electronic Part Life Cycle

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 1, 2000, Pages 190-192

  Pecht, Michael G ^a   Das, Diganta ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 85008060371     PISSN: 15213331     EISSN: 15579972     Source Type: Journal    
DOI: 10.1109/6144.833060     Document Type: Article

References (4)

1. B. Foucher et al., “Why a new parts selection and management program?,” IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 21, pp. 375-382, June 1998.
2. B. Foucher et al., “The changing dream: Silicon Valley survey,” Economist, p. 19, Mar. 29-Apr. 4, 1997.
3. B. Foucher et al., “1999 Standard linear and logic product withdrawal device list,” Texas Instruments, Sept. 2, 1999.
4. B. Foucher et al., “Product Folder LF11331,” National Semiconductor, Dec. 20, 1999.