Uprating electronic components for use outside their temperature specification limits

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 2, 1997, Pages 252-256

  Wright, Mark B ^a   Humphrey, David ^b   McCluskey, F Patrick ^c  

^a DY4 Systems Inc   (Canada)

^b HONEYWELL   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000215280     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.588581     Document Type: Article

References (7)

1. R. Guy, private communication, Lucent Technologies Component Evaluation Technology Center, Wichita, KS.
2. Semiconductory Industry Association, "The National Technology Roadmap for Semiconductors," San Jose, CA, 1994.
3. J. Jordan, M. Pecht, and J. Fink, "How burn-in can reduce quality and reliability," Int. J. Microcircuits., vol. 1, pp. 1-7, 1997.
4. D. Barker, "Ruggedizing laptop computers for mobile applications," presented at the first workshop on use of components outside specified temperature limits, CALCE EPRC, Univ. Maryland, College Park, Jan. 23, 1997.
5. K. Davila-Rieth, "Uprating assemblies for military computer systems," presented at the first workshop on use of components outside specified temperature limits, CALCE EPRC, Univ. Maryland, College Park, Jan. 23, 1997.
6. M. Jackson, P. Lall, and D. Das, "Thermal derating: A factor of safety or ignorance," IEEE Trans. Comp., Packag., Manufact. Technol., vol 20, pp. 83- 85, Mar. 1997.
7. R. Kroger, "Manufacturer part assessment: A pragmatic approach," presented at the first workshop on use of components outside specified temperature limits, CALCE EPRC, Univ. Maryland, College Park, Jan. 23, 1997.