Characterization of Cu surface cleaning by hydrogen plasma

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 19, Issue 4, 2001, Pages 1201-1211

  Baklanov, M R ^a   Shamiryan, D G ^a,b   Tokei Zs ^a   Beyer, G P ^a   Conard, T ^a   Vanhaelemeersch, S ^a   Maex, K ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CHEMISORPTION; COPPER OXIDES; DESORPTION; ELLIPSOMETRY; ETCHING; HEAT TREATMENT; HYDROGENATION; METAL CLEANING; SECONDARY ION MASS SPECTROMETRY; SURFACE STRUCTURE; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER CARBONATE; COPPER HYDOXIDE; CUPRIC OXIDE; CUPROUS OXIDE; FUORINE PLASMA; HYDROGEN PLASMA;

COPPER;

EID: 0035535247     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1387084     Document Type: Conference Paper

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