Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 5, 1999, Pages 2136-2146

  Baklanov, M R ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 22844455311     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. W. W. Lee and P. S. Ho, MRS Bull. 22, 10 (1997).
2. H. G. Tompkins and C. Tracy, J. Vac. Sci. Technol. B 8, 558 (1990).