Effect of deformation behavior on solder joint reliability prediction

First International Conference on Microstructures and Mechanical Properties of Aging Materials

Volumn , Issue , 1993, Pages 399-408

  Darveaux, Robert ^a   Murty, K Linga ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DEFORMATION; EUTECTICS; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; LEAD ALLOYS; MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; RELIABILITY; STRENGTH OF MATERIALS; TENSILE TESTING; TIN ALLOYS;

CREEP RUPTURE; GRAIN BOUNDARY SLIDING; THERMAL CYCLE FATIGUE;

SOLDERED JOINTS;

EID: 0027812225     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (25)