Issues in validating package compact thermal models for natural convection cooled electronic systems

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1997, Pages 10-23

  Adams, V H ^a   Blackburn, D L ^a   Joshi, Y ^a   Berning, D W ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; MATHEMATICAL MODELS; NATURAL CONVECTION; PRINTED CIRCUIT BOARDS; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY;

ELECTRONIC SYSTEMS; THERMAL MODELS;

ELECTRONICS PACKAGING;

EID: 0030736276     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)