Thermal analysis of a chip on board (COB)

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1997, Pages 112-118

  De Moerloose, J ^a   Temmerman, W ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; COMPUTER SIMULATION; ENERGY DISSIPATION; HEAT RESISTANCE; HEAT SINKS; SEMICONDUCTOR JUNCTIONS; TEMPERATURE; THERMOANALYSIS;

BROADBAND LINE BOARD; CHIP INTERCONNECTION; CHIP ON BOARDS; CLOCK CHIP;

MULTICHIP MODULES;

EID: 0030734466     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)