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Volumn 13, Issue 6, 1998, Pages 1208-1219

Thermal Resistance Analysis By Induced Transient (TRAIT) method for power electronic devices thermal characterization - Part I: Fundamentals and theory

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC NETWORK ANALYSIS; ELECTRONICS PACKAGING; EQUIVALENT CIRCUITS; HEAT RESISTANCE; TEMPERATURE MEASUREMENT; THERMOANALYSIS;

EID: 0032204042     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/63.728348     Document Type: Article
Times cited : (225)

References (20)
  • 2
    • 0007097719 scopus 로고
    • Transient thermal impedance of semiconductor devices
    • E. J. Diebold and W. Luft, "Transient thermal impedance of semiconductor devices," AIEE Trans., vol. 79, pt. J p. 719, 1961.
    • (1961) AIEE Trans. , vol.79 , Issue.PART J , pp. 719
    • Diebold, E.J.1    Luft, W.2
  • 4
    • 0028208037 scopus 로고    scopus 로고
    • Analysis of thermal transient data with systemized dynamic models for semiconductor devices
    • San Jose, CA
    • J. W. Sofia, "Analysis of thermal transient data with systemized dynamic models for semiconductor devices," in Proc. SEMITHERM'94, San Jose, CA, pp. 78-85.
    • Proc. SEMITHERM'94 , pp. 78-85
    • Sofia, J.W.1
  • 5
    • 33747595263 scopus 로고    scopus 로고
    • Experimental thermal parameter extraction using nondestructive tests
    • Sevilla, Spain
    • E. Farjah, C. Schaeffer, and R. Perret, "Experimental thermal parameter extraction using nondestructive tests," in Proc. EPE'95 Conf., Sevilla, Spain, vol. 1, pp. 1.245-1.248.
    • Proc. EPE'95 Conf. , vol.1
    • Farjah, E.1    Schaeffer, C.2    Perret, R.3
  • 6
  • 8
    • 0024069775 scopus 로고
    • Fine structure of heat flow path in semiconductor devices: A measurement and identification method
    • V. Szekely and T. Van Bien, "Fine structure of heat flow path in semiconductor devices: A measurement and identification method," Solid State Electron., vol. 31, pp. 1363-1368, 1988.
    • (1988) Solid State Electron. , vol.31 , pp. 1363-1368
    • Szekely, V.1    Van Bien, T.2
  • 9
    • 0027908348 scopus 로고
    • Complete characterization of laser diode thermal circuit by voltage transient measurements
    • A. Piccirillo, G. Oliveti, M. Ciampa, and P. E. Bagnoli, "Complete characterization of laser diode thermal circuit by voltage transient measurements," Electron. Lett., vol. 29, pp. 318-320, 1993.
    • (1993) Electron. Lett. , vol.29 , pp. 318-320
    • Piccirillo, A.1    Oliveti, G.2    Ciampa, M.3    Bagnoli, P.E.4
  • 10
    • 84907686519 scopus 로고
    • Experimental analysis of laser diode thermal characteristics by voltage transient measurements
    • Grenoble, France
    • P. E. Bagnoli, A. A. Piccirillo, S. Mottet, M. Thual, G. Oliveti, and M. Ciampa, "Experimental analysis of laser diode thermal characteristics by voltage transient measurements," in Proc. ESSDERC Conf., Grenoble, France, 1993, pp. 287-290.
    • (1993) Proc. ESSDERC Conf. , pp. 287-290
    • Bagnoli, P.E.1    Piccirillo, A.A.2    Mottet, S.3    Thual, M.4    Oliveti, G.5    Ciampa, M.6
  • 11
    • 0022079957 scopus 로고
    • An analysis of the thermal response of power chip packages
    • V. Kadambi and N. Abuaf, "An analysis of the thermal response of power chip packages," IEEE Trans. Electron Devices, vol. ED-3, pp. 1024-1033, 1973.
    • (1973) IEEE Trans. Electron Devices , vol.ED-3 , pp. 1024-1033
    • Kadambi, V.1    Abuaf, N.2
  • 12
    • 0343510569 scopus 로고
    • Modello conduttivo per l'analisi termica di strutture multistrato in elettronica
    • Perugia, Italy, in Italian
    • C. Casarosa and M. Ciampi, "Modello conduttivo per l'analisi termica di strutture multistrato in elettronica," in Proc. 49° ATI National Conf., Perugia, Italy, 1994, pp. 227-245 (in Italian).
    • (1994) Proc. 49° ATI National Conf. , pp. 227-245
    • Casarosa, C.1    Ciampi, M.2
  • 15
    • 33747602394 scopus 로고    scopus 로고
    • Thermal behavior of power modules in PWM-inverter
    • Sevilla, Spain
    • S. Konrad, "Thermal behavior of power modules in PWM-inverter," in Proc. EPE'95 Conf., Sevilla, Spain, vol. 1, pp. 1.565-1.570.
    • Proc. EPE'95 Conf. , vol.1
    • Konrad, S.1
  • 16
    • 0032202670 scopus 로고    scopus 로고
    • Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization - Part II: Practice and experiments
    • P. E. Bagnoli, C. Casarosa, E. Dallago, and M. Nardoni, "Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization - Part II: Practice and experiments," IEEE Trans. Power Electron., vol. 13, no. 6, pp. 1220-1228, 1998.
    • (1998) IEEE Trans. Power Electron. , vol.13 , Issue.6 , pp. 1220-1228
    • Bagnoli, P.E.1    Casarosa, C.2    Dallago, E.3    Nardoni, M.4
  • 18
    • 0040534139 scopus 로고
    • Experimental characterization of automotive electronic packaging by TRAIT method: Preliminary results
    • Milan, Italy, June
    • A. Maierna, M. Bezza, P. E. Bagnoli, C. Casarosa, E. Dallago, and F. Perotti, "Experimental characterization of automotive electronic packaging by TRAIT method: Preliminary results," in Proc. ISHM Conf., Milan, Italy, June 1994, pp. 209-216.
    • (1994) Proc. ISHM Conf. , pp. 209-216
    • Maierna, A.1    Bezza, M.2    Bagnoli, P.E.3    Casarosa, C.4    Dallago, E.5    Perotti, F.6
  • 19
    • 0012700460 scopus 로고
    • Thermal resistance analysis by induced transient (TRAIT) applied to power electronic device packaging
    • Sevilla, Spain, Sept.
    • P. E. Bagnoli, C. Casarosa, E. Dallago, G. Sassone, and A. Maierna, "Thermal resistance analysis by induced transient (TRAIT) applied to power electronic device packaging," in Proc. EPE'95 Conf., Sevilla, Spain, Sept. 1995, vol. 3, pp. 3.322-3.327.
    • (1995) Proc. EPE'95 Conf. , vol.3
    • Bagnoli, P.E.1    Casarosa, C.2    Dallago, E.3    Sassone, G.4    Maierna, A.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.