Numerical modeling of interfacial delamination propagation in a novel peripheral array package

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 2, 2001, Pages 256-263

  Harries, R J ^a   Sitaraman, S K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Delamination; Energy release rate; Fracture toughness; Mode mixity; Peripheral array package

Indexed keywords

ADHESIVES; CRACK PROPAGATION; ELECTRONICS PACKAGING; FRACTURE; FRACTURE TOUGHNESS; MATHEMATICAL MODELS; SURFACE TENSION; THERMAL STRESS;

PERIPHERAL ARRAY PACKAGES;

DELAMINATION;

EID: 0035364799     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.926391     Document Type: Article

References (29)

1. Integration of crack growth models with finite element analysis to predict the reliability of portable electronic products
2. Delamination cracking in encapsulated flip chips
3. Reliability assessment of flip-chip and CSP
4. Cracks on bimaterial interfaces: Elasticity and plasticity aspects
5. A stress singularity parameter approach for evaluating the interfacial reliability of plastic encapsulated LSI devices
6. Influence of chip/encapsulant delamination on the thermo-structural behavior of a thermally-pulsed plastic IC package
7. Bimaterial interfacial crack growth as a function of mode-mixity in resin/copper Interface
8. Effect of internal package delaminations on the thermal performance of PQFP, thermally enhanced PQFP, LOC, and BGA packages Proceedings
9. Parametric study of a VLSI plastic package subjected to encapsulation, moisture absorption and solder reflow process
10. An interfacial delamination analysis for multichip module thin film interconnects
11. Evaluation of plastic package delamination via reliability testing and fracture mechanics approach
12. Analysis and modeling verification for thermal-mechanical deformation in flip-chip packages
13. Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading
14. Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering
15. Analysis of delamination in IC packages using a new variable-order singular boundary element
16. Impact of moisture diffusion during solder reflow on package reliability
17. An investigation to popcorning mechanisms for IC plastic packages: EMC cracking
18. On the popcorning mechanics of plastic packages
19. Process modeling and interfacial behavior in the VSPA Package
20. Interfacial fracture toughness for delamination growth prediction in a novel peripheral array package
21. The stresses around a fault or crack in dissimilar media
22. Stress distribution in a nonhomogeneous elastic plane with cracks
23. A crack between dissimilar media
24. A method for calculating stress intensities in bimaterial fracture
25. A finite element calculation of stress intensity factors by a modified crack closure integral
26. Assessment of fully plastic J and C*-integral solutions for application to elastic-plastic fracture and creep crack growth
27. t paramrter for increasing loading conditions