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IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 2, 2001, Pages 265-270

Interfacial fracture toughness for delamination growth prediction in a novel peripheral array package

(2) Sundararaman, V a Sitaraman, S K a

a GEORGIA INSTITUTE OF TECHNOLOGY (United States)

Author keywords

Delamination; Electronic packaging; Fracture toughness test; Interfacial fracture; VSPATM

Indexed keywords

COMPUTER SIMULATION; DELAMINATION; ENCAPSULATION; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; RESIDUAL STRESSES; THERMAL STRESS;

PERIPHERAL ARRAY PACKAGES;

ELECTRONICS PACKAGING;

EID: 0035364509 PISSN: 15213331 EISSN: None Source Type: Journal
DOI: 10.1109/6144.926392 Document Type: Article

Times cited : (11)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.