Process modeling and interfacial behavior in the VSPA package

American Society of Mechanical Engineers, Materials Division (Publication) MD

Volumn 80, Issue , 1997, Pages 293-299

  Harries, Richard ^a   Sitaraman, Suresh ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK PROPAGATION; DELAMINATION; ELECTRONICS PACKAGING; ENCAPSULATION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; STRESS ANALYSIS;

INTERFACIAL DELAMINATION;

INTERFACES (MATERIALS);

EID: 0031339625     PISSN: 10716939     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

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