On the popcorning mechanics of plastic packages

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Liu, Sheng ^a   Dai, Jiabin ^a  

^a Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; EVAPORATION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; MOISTURE; PACKAGING MATERIALS; PLASTIC PRODUCTS; SOLDERING; STRESS ANALYSIS; WATER ABSORPTION;

ENCAPSULANT MOLDING COMPOUNDS (EMC); PLASTIC PACKAGES; POPCORNING MACHINES; SHADOW MOIRE TECHNIQUES;

ELECTRONICS PACKAGING;

EID: 0343602901     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (34)

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