Using computer models to identify optimal conditions for flip-chip assembly and reliability

Circuit World

Volumn 28, Issue 1, 2001, Pages 14-20

  Bailey, Christopher ^a   Lu, Hua ^a   Glinski, Greg ^a   Wheeler, Daniel ^a   Hamilton, Phil ^b   Hendriksen, Mike ^b   Smith, Brian ^b  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b Celestica Limited   (United Kingdom)

Author keywords

Flip chip; Modelling; Reflow; Reliability; Solder paste; Underfill

Indexed keywords

ASSEMBLY; HEAT TRANSFER; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SOLIDIFICATION; THERMAL STRESS;

FLIP-CHIP ASSEMBLY;

FLIP CHIP DEVICES;

EID: 0035181178     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120210696658     Document Type: Article

References (24)

1. An integrated modelling approach to solder joint formation
2. Large-scale parallel simulations for the assembly of flip-chip components to printed circuit boards
3. Industry's stated needs
4. Miniature packaging trends
5. New challenges in solder paste printing
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7. Non-newtonian computational fluid dynamics study of the stencil printing process
8. Material properties, geometry and their effect on the fatigue life of two flip-chip packages
9. Reliability analysis of flip chip via computer simulation
10. Flow processes in solder paste during stencil printing for SMT assembly
11. The theological properties of solder and solar pastes and the effect on stencil printing
12. A parametric study of flip-chip reliability based on solder fatigue modelling
13. A general statement of the problem and description of a proposed method of calculation of some meniscus problems in materials processing
14. Modelling the melting and solidification of solder material
15. Modelling technology to predict flip-chip assembly
16. A computational modelling framework to predict macroscopic phenomena in the formation of solder joints