An integrated modeling approach to solder joint formation

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 4, 1999, Pages 497-502

  Bailey, Christopher ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Multiphysics modeling; Solder; Solidification; Surface tension; Thermal stress

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COMPUTER SOFTWARE; COOLING; HEAT TRANSFER; MATHEMATICAL MODELS; PRINTED CIRCUIT MANUFACTURE; SOLDERED JOINTS; SOLDERING ALLOYS; SOLIDIFICATION; SURFACE TENSION; THERMAL STRESS;

COMPUTATIONAL SOLID MECHANICS (CSM); MULTIPHYSICS MODELING;

PRINTED CIRCUIT BOARDS;

EID: 0033316492     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.814964     Document Type: Article

References (13)

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