Modelling technology to predict flip-chip assembly

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 79-85

  Wheeler, D ^a   Bailey, C ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; COOLING; CURING; DEFORMATION; DELAMINATION; ENTHALPY; FLIP CHIP DEVICES; HEATING; PRINTED CIRCUIT BOARDS; STRESS ANALYSIS; SUBSTRATES;

REFLOW PROCESS; THERMAL MISMATCH; THERMAL SOLIDIFICATION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033694423     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (16)