A computational modelling framework to predict macroscopic phenomena in solder joint formation

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture

Volumn 212, Issue 2, 1998, Pages 141-157

  Wheeler, D ^a   Bailey, C ^a   Cross, M ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Model implementation; Printed circuit boards; Solder joint

Indexed keywords

CALCULATIONS; COOLING; FINITE ELEMENT METHOD; HEAT TRANSFER; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; STRESSES;

MODEL IMPLEMENTATION;

SOLDERED JOINTS;

EID: 0031650490     PISSN: 09544054     EISSN: None     Source Type: Journal    
DOI: 10.1243/0954405981515563     Document Type: Article

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