Modelling the melting and solidification of solder material

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 397-404

  Wheeler, Daniel ^a   Bailey, Christopher ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347663678     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)

1. Croft, T., 1993, "Unstructured Mesh - Finite Volume Algorithms for Swirling, Turbulent, Reacting Flows," Ph.D. Thesis, University of Greenwich.
2. Goenka, L. and Achari, A., 1996, "Void Formation in Flip-Chip Solder Bumps," in: IEEE/CPMT International Electronics Manufacturing Technology Symposium, pp. 430-435.
3. O'Hara, W. and Lee, N., 1995, "Voiding in BGAs," Soldering and Surface Mount Technology, Vol. 21, pp. 44-48.
4. Pericleous, K., Moarn, G., Bounds, S., Chow, P., and Cross, M., 1998, "Three dimensional free surface modelling in an unstructured mesh environment for metal processing appications," submitted for publication.
5. PHYSICA, 1998, PHYSICA - A software environment for the modelling of Multi-physics Phenomena, University Of Greenwich, Wellington Street, London, SE18 6PF, UK, available from http://physica.gre.ac.uk/.
6. Sussman, M., Smereka, P., and Osher, S., 1994, "A Level Set Approach for Computing Solutions to Incompressible Two-Phase Flow," Journal of Computational Physics, Vol. 114, pp. 146-159.
7. Voller, V. and Swaminathan, C., 1992, "General Source Based Method for Solidification Phase Change," International Journal For Numerical Methods In Engineering, Vol. 35, pp. 1849-1870.