Material properties, geometry and their effect on the fatigue life of two flip-chip models

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 65-72

  Lu, Hua ^a   Bailey, C ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FATIGUE OF MATERIALS; INTEGRATED CIRCUIT LAYOUT; PRINTED CIRCUIT BOARDS; RELIABILITY; STRAIN; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EXPANSION; THERMAL LOAD;

COFFIN-MANSON EMPIRICAL RELATIONSHIP; CYCLIC THERMAL LOADING; MICROVIA TECHNOLOGY;

FLIP CHIP DEVICES;

EID: 0033694604     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)