The rheological properties of solder and solar pastes and the effect on stencil printing

Rheologica Acta

Volumn 39, Issue 6, 2000, Pages 607-612

  Nguty, T A ^a   Ekere, N N ^a  

^a Bookham Technology   (United Kingdom)

Author keywords

Creep recovery; Rheology; Solar cells; Solar paste; Solder paste; Steady shear; Viscosity

Indexed keywords

CREEP; PASTE; RHEOLOGY; VISCOSITY;

EID: 0033663182     PISSN: 00354511     EISSN: None     Source Type: Journal    
DOI: 10.1007/s003970000117     Document Type: Article

References (13)

1. A theory of flow as a cooperative phenomenon
2. Thin film metallization for solar cell applications
3. Characterisation of solder pastes used in the reflow soldering of surface mount assembly
4. Generalised Cole-Cole behaviour and its rheological relevance
5. The importance of paste rheology in improving fine line, thick film screen printing of front side metallization
6. New development in fluxing and fluxes
7. Requirements for solder pastes
8. Rheological characterisation of solder paste for surface mount applications
9. Rheological characterisation of solder pastes
10. Modelling the effects of temperature on the rheology of solder pastes and flux system
11. Rheology of pastes in thick-film printing