Electronics packaging technology update: BGA, CSP, DCA, and flip chip

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 32-36

  Lau, John H ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; FLIP CHIP DEVICES; INDUSTRIAL ELECTRONICS; INTEGRATED CIRCUIT MANUFACTURE; MULTICHIP MODULES; PRINTED CIRCUIT MANUFACTURE;

BALL GRID ARRAY (BGA); CHIP SCALE PACKAGING (CSP); DIRECT CHIP ATTACH (DCA);

ELECTRONICS PACKAGING;

EID: 0030721920     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (27)