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Volumn 38, Issue 14, 1998, Pages 67-69
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Socket adapter systems simplify BGA assembly
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRIC INSULATING MATERIALS;
ELECTRONICS PACKAGING;
HEAT SINKS;
MICROPROCESSOR CHIPS;
PRINTED CIRCUIT BOARDS;
QUALITY ASSURANCE;
SOLDERING;
BALL GRID ARRAYS;
PIN GRID ARRAYS;
QUAD FLAT PACKS;
SOCKET ADAPTER SYSTEMS;
INTEGRATED CIRCUIT MANUFACTURE;
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EID: 0032203573
PISSN: 00134945
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (1)
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References (0)
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