Packaging technologies for RFIC's: current status and future trends

IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers

Volumn , Issue , 1999, Pages 7-10

  Imhoff, Albert C ^a  

^a AMP M/A COM Semiconductor ^*

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAY; PACKAGING TECHNOLOGY; RADIO FREQUENCY INTEGRATED CIRCUITS;

INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUITS; MULTICHIP MODULES; SURFACE MOUNT TECHNOLOGY; WIRELESS TELECOMMUNICATION SYSTEMS;

ELECTRONICS PACKAGING;

EID: 0032645497     PISSN: 10972633     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RFIC.1998.682036     Document Type: Conference Paper

References (5)