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A selective-epitaxial SiGe HBT with SMI electrodes featuring 9.3-ps ECL-gate delay
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95 GHz fT self-aligned selective epitaxial SiGe HBT with SMI electrodes
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130-GHz fT SiGe HBT technology
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A 0.2-μm self-aligned SiGe HBT featuring 107-GHz f and 6.7-ps ECL
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82 GHz dynamic frequency divider in 5.5 ps ECL SiGe HBTs
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K. Washio, E. Ohue, K. Oda, R. Hayami, M. Tanabe, H. Shimamoto, T. Harada, and M. Kondo, "82 GHz dynamic frequency divider in 5.5 ps ECL SiGe HBTs," in ISSCC Tech. Dig., 2000, pp. 210-211.
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A 0.2-μm bipolar-CMOS technology on bonded SOI with copper metallization for ultra high-speed processors
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T. Hashimoto, T. Kikuchi, K. Watanabe, N. Ohashi, T. Saito, H. Yamaguchi, S. Wada, N. Natsuaki, M. Kondo, S. Kondo, Y. Homma, N. Owada, and T. Ikeda, "A 0.2-μm bipolar-CMOS technology on bonded SOI with copper metallization for ultra high-speed processors," in IEDM Tech. Dig., 1998, pp. 209-212.
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A 7.7-ps CML using selective- epitaxial SiGe HBTs
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An 8-bit 250 megasample per second analog-to-digital converter: Operation without a sample and hold
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